International Journal of Engineering Technology and Computer Research http://ijetcr.org/index.php/ijetcr <p><a title="ICV" href="https://journals.indexcopernicus.com/search/reportList/41861" target="_blank" rel="noopener"><img src="http://ijesar.in/public/site/images/ijesaradmin/DOI.jpg"></a></p> <p style="text-align: justify;">&nbsp;<span style="font-family: lucida sans unicode,lucida grande,sans-serif;"><span style="font-size: 14px;"><strong>International Journal of Engineering Technology and Computer Research (IJETCR) is a full-text database of OJS journal</strong></span></span></p> <p style="text-align: justify;"><span style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">IJETCR is International publisher of academic and research journals; IJETCR publishes and develops titles in groups with the world's most prestigious learned societies and publishers. Our goal is to bring high quality research work</span></p> <p style="text-align: justify;"><span style="font-family: lucida sans unicode,lucida grande,sans-serif;"><span style="font-size: 14px;"><strong>Aims and Scope&nbsp;&nbsp;</strong></span></span></p> <p style="text-align: justify;"><span style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">International Journal of Engineering Technology and Computer Research (IJETCR)&nbsp;is an&nbsp;Open Access, international, multidisciplinary journals hub in the field multi disciplinary&nbsp;and will publish original research papers, short communications, invited reviews, Case studies and editorial commentary and news, Opinions &amp; Perspectives and Book Reviews written at the invitation of the Editor in following fields</span></p> <p style="text-align: justify;"><span style="font-family: lucida sans unicode,lucida grande,sans-serif;"><span style="font-size: 14px;"><strong>Important Notice&nbsp;&nbsp;</strong></span></span></p> <p style="text-align: justify;"><span style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">Authors can now directly send their manuscript as an email attachment to editor@ijetcr.org&nbsp;</span></p> <p style="text-align: justify;"><span style="font-family: lucida sans unicode,lucida grande,sans-serif;">All manuscripts are subject to rapid peer review. Those of high quality (not previously published and not under consideration for publication in another journal) will be published without delay. First-time users are required to register themselves as an author before making submissions by signing up the author registration form at journals website:&nbsp;</span><span style="font-size: 14px; font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">www. http://ijetcr.org</span></p> <p style="text-align: justify;"><span style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">With the online journal management system that we are using, authors will be able to track manuscripts progress through the editorial process by logging in as author in authors Dashboard.</span></p> <p style="text-align: justify;"><span style="font-family: lucida sans unicode,lucida grande,sans-serif;"><span style="font-size: 14px;"><strong>Top Reasons for publication with us</strong></span></span></p> <p style="text-align: justify;"><strong style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">Quick Quality Review:</strong><span style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">&nbsp;The journal has strong international team of editors and reviewers, Rapid Decision and Publication</span></p> <p style="text-align: justify;"><strong style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">Very Low Publication Fees:</strong><span style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">&nbsp;Comparable journals charge a huge sum for each accepted manuscript. IJETCR only charge the fees necessary to recoup cost associated with running the journal</span></p> <p style="text-align: justify;"><strong style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">Other features:</strong><span style="font-family: 'lucida sans unicode', 'lucida grande', sans-serif;">&nbsp;DIDS // DOI - Assigned and Implemented the Open Review System (ORS).</span></p> en-US <p><img style="border-width: 0;" src="http://i.creativecommons.org/l/by/4.0/88x31.png" alt="Creative Commons License" width="60" height="21" border="0"><strong>International Journal of Engineering&nbsp;</strong><strong>Technology and Computer Research (IJETCR)&nbsp;</strong><span style="line-height: 1.3em;">by </span><span style="line-height: 1.3em;">Articles</span><span style="line-height: 1.3em;"> is licensed under a </span><a style="line-height: 1.3em;" title="Journal of Biomedical and Pharmaceutical Research" href="http://creativecommons.org/licenses/by/4.0/" target="_blank" rel="license noopener">Creative Commons Attribution 4.0 International License</a><span style="line-height: 1.3em;">.</span></p> editor@ijetcr.org (IJETCR JOURNAL) editorijetcr.org@gmail.com (IJETCR-TEAM) Mon, 30 Jul 2018 00:39:58 -0500 OJS 3.1.1.0 http://blogs.law.harvard.edu/tech/rss 60 “Analysis of Steel Slab for Unsteady State Heat Conduction by Hermite Aproximation” http://ijetcr.org/index.php/ijetcr/article/view/478 <p><em>This paper presents the ideas on improvement of lumped-parameter model for unsteady state (transient) heat conduction in a slab with temperature-dependent thermal conductivity. The transient temperature depends on various model parameter, they are Biot number, heat source and time. Polynomial Approximation Method (PAM) has been possible to derive a unified relation for the transient thermal behavior of solid (slab and tube) with both internal heat generation and boundary heat flux.&nbsp; In all the cases, a closed form solution is obtained between temperature, Biot number, heat source parameter and time. </em></p> <p><em>A lumped parameter model (steel slab) has been adopted through two point Hermite approximations for integrals. For linearly temperature-dependent thermal conductivity, it is shown by comparison with numerical solution of the original distributed parameter model that the higher order lumped model yields significant improvement of average temperature prediction over the lumped model. For both cooling and heating processes a unified Biot number limit depending on a single dimensionless parameter </em><em>b</em><em> is given. The result of the present analysis </em><em>can be used for conduction slab in heat exchanger and can withstand up to given temperature range.</em></p> <p><strong><em>Key words:</em></strong><em>&nbsp; Hermite approximations, PAM, thermal conductivity, lumped model, nonlinear heat conduction, heat conduction, Biot number.</em></p> Vinod Singh Yadav, Ashish Patidar, Devendra Singh Sikarwar ##submission.copyrightStatement## http://ijetcr.org/index.php/ijetcr/article/view/478 Mon, 30 Jul 2018 00:00:00 -0500